Selective silicon growth for gapfill improvement

ABSTRACT

Embodiments disclosed herein relate generally to forming a gate layer in high aspect ratio trenches using a cyclic deposition-treatment process. In an embodiment, a method includes subjecting a substrate surface having at least one feature to a film deposition process to form a conformal film over a bottom surface and along sidewall surfaces of the feature, subjecting the substrate surface to a treatment process to form respective halogen surface layers or respective halogen-terminated layers on the conformal film formed at respective upper portions of the sidewall surfaces, and performing sequentially and repeatedly the film deposition process and the treatment process to fill the feature with the film.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional of U.S. application Ser. No.15/992,357, filed on May 30, 2018, which application is herebyincorporated herein by reference.

BACKGROUND

As the semiconductor industry has progressed into nanometer technologyprocess nodes in pursuit of higher device density, higher performance,and lower costs, challenges from both fabrication and design issues haveresulted in the development of three-dimensional designs, such as a FinField Effect Transistor (FinFET). FinFET devices typically includesemiconductor fins with high aspect ratios and in which channel andsource/drain regions are formed. A gate is formed over and along thesides of the fin structure (e.g., wrapping) utilizing the advantage ofthe increased surface area of the channel to produce faster, morereliable, and better-controlled semiconductor transistor devices. Withthe decreasing in scaling, however, it has been challenging to deposit afilm in high aspect ratio trenches with small dimension without formingvoids or seams.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a flow chart illustrating an exemplary method for fabricatinga semiconductor device structure according to some embodiments.

FIG. 2 illustrates an example dummy gate layer formation processaccording to some embodiments.

FIGS. 3 through 13, 14A-14B, 15A-15C, and 16A-16B through 18A-18Billustrate a various schematic three-dimensional and cross-sectionalviews of an example semiconductor device structure corresponding tovarious stages of fabrication according to some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, forexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments described herein relate to depositing a film or layer insemiconductor processing. Embodiments specifically described herein arein the context of depositing a film or layer in trenches between fins,which trenches can be a high aspect ratio. A cyclic deposition-treatmentprocess can include depositing a portion of the film or layer, treatinga top portion of the film or layer to passivate the top portion of thefilm or layer, and repeating the depositing and treating any number oftimes. The treating can reduce a rate of growth of the film or layer atthe passivated top portion during a subsequent deposition such that thecyclic deposition-treatment process can form the film or layersubstantially bottom-up in the trench, which can therefore avoidformation of voids or seams in the film or layer in the trench. Aspectsof examples described herein can be applied to depositing a film orlayer in any trench or recess, which may be a high aspect ratio.

FIG. 1 is a flow chart 100 illustrating an exemplary method forfabricating a semiconductor device structure 240 according to someembodiments. FIG. 2 illustrates an example dummy gate layer formationprocess 150 that can be used during an operation 106 of the flow chart100 of FIG. 1 according to some embodiments. FIGS. 3 through 13, 14A-B,15A-C, and 16A-B through 18A-B are schematic three-dimensional andcross-sectional views of a portion of the semiconductor device structure240 corresponding to various stages of fabrication according to the flowchart of FIG. 1 in accordance with some embodiments. It is noted thatthe flow chart 100 may be utilized to form any other semiconductorstructures not presented herein. Those skilled in the art shouldrecognize that a full process for forming a semiconductor device and theassociated structures are not illustrated in the drawings or describedherein. Although various operations are illustrated in the drawings anddescribed herein, no limitation regarding the order of such steps or thepresence or absence of intervening steps is implied. Operations depictedor described as sequential are, unless explicitly specified, merely doneso for purposes of explanation without precluding the possibility thatthe respective steps are actually performed in concurrent or overlappingmanner, at least partially, if not entirely.

The flow chart 100 begins at operation 102, and further with referenceto FIG. 3, by providing a semiconductor device structure 240. Thesemiconductor device structure 24 o has fins 274 formed on asemiconductor substrate 270. The semiconductor substrate 270 may be orinclude a bulk semiconductor substrate, a semiconductor-on-insulator(SOI) substrate, or the like, which may be doped (e.g., with a p-type oran n-type dopant) or undoped. In some embodiments, the semiconductormaterial of the semiconductor substrate 270 may include an elementalsemiconductor including silicon (Si) or germanium (Ge); a compoundsemiconductor; an alloy semiconductor; or a combination thereof. Eachfin 274 provides an active area where one or more devices are to beformed. The fins 274 are fabricated using suitable processes performedon the semiconductor substrate 270, including masking, photolithography,and/or etch processes, to form trenches 253 into the substrate 270,leaving the fins extended upwardly from the substrate 270. The trenches253 may then be filled with an insulating material. The insulatingmaterial may be any suitable dielectric such as an oxide (e.g., siliconoxide), a nitride, the like, or a combination thereof. The insulatingmaterial is then recessed, such as by using an acceptable etch process,to form isolation regions 248. The insulating material is recessed suchthat the top portion of the fins 274 is exposed. The fins 274 protrudeabove and from between neighboring isolation regions 248.

FIG. 3 further illustrates a cross-section A-A. FIGS. 4 through 13 and14A illustrate cross-sections of the semiconductor device structure 240corresponding to the cross-section A-A at various stages of fabrication.

At operation 104, and further with reference to FIG. 4, an interfacialdielectric layer 202 is conformally formed over the substrate 270 tocover the fins 274 and the exposed surfaces of the isolation regions248. The interfacial dielectric layer 202 may include or be siliconoxide, silicon nitride, the like, or multilayers thereof, and may bethermally and/or chemically grown on the fins 274, or conformallydeposited, such as by PECVD, ALD, or any suitable deposition technique.In some embodiments, and further at operation 104, a seed layer 204 maybe conformally formed on the interfacial dielectric layer 202. Inset 201in FIG. 4 is a partially enlarged view showing the interfacialdielectric layer 202 having the seed layer 204 formed thereon. The seedlayer 204 is formed on the interfacial dielectric layer 202 to helpuniform growth of the subsequent gate on the fins 274 and the isolationregions 248. The seed layer 204 may be chosen depending on the materialof the subsequent gate. In some embodiments where the subsequent gateincludes silicon (e.g., polysilicon or amorphous silicon), the seedlayer 204 may be a silicon-containing film. In such a case, the seedlayer 204 can be formed by exposing the substrate surface to asilicon-containing compound to form a solid thin film layer containingsilicon on the interfacial dielectric layer 202. The term “substratesurface” in this disclosure is intended to include the exposed surfaceof a film/layer or partial film/layer that has been deposited onto asubstrate, such as the substrate 270, and the exposed surface of thenewly deposited film/layer can also become the substrate surface priorto any subsequent process(es). The seed layer 204 may be formed byatomic layer deposition (ALD), chemical vapor deposition (CVD), or anysuitable deposition technique. In some embodiments, the seed layer 204is a silicon layer formed by ALD. Suitable silicon-containing compoundsmay include, but are not limited to, (SiH₃)3N, Si[N(CH₃)₂]₄,SiH[N(CH₃)₂]₃, SiH₂[N(CH₃)₂]₂, SiH₃[N(CH₃)₂], SiH₃[N((CH—(CH₃)₂)₂], thelike, or combinations thereof. In some embodiments, the seed layer 204is formed using SiH₃[N((CH—(CH₃)₂)₂].

After operation 104, a dummy gate layer is formed over the substratesurface (e.g., over the interfacial dielectric layer 202 and/or the seedlayer 204 if used) and fills the trenches 253. Each of the trenches 253has a bottom surface 255 (e.g., top surface of the isolation region 248)and sidewall surfaces 257 extending upwardly from the bottom surface255. In various embodiments, the trenches 253 may have an aspect ratioof about 3:1 to about 30:1, such as about 5:1 to about 20:1, for exampleabout 8:1 to about 10:1. The term “aspect ratio” refers to the ratio ofthe height dimension to the width dimension of a particular feature, forexample, trench height/trench width. The trench height substantiallyequals to the height of the fins 274 protruding above the isolationregions 248 while the trench width substantially equals to the width ordistance of the isolation region 248 between two neighboring fins 274.

The film can be any suitable film, such as a film for forming a dummygate layer. In some embodiments, the film formed is an amorphous siliconfilm. For gate replacement processes, the dummy gate layer may be formedof poly-silicon or amorphous silicon.

A dummy gate layer formation process described herein may deposit a filmin high aspect ratio trenches without forming a seam or void.Particularly, the dummy gate formation process can be used to fillfeatures with any suitable aspect ratio (ratio of the depth of thefeature to the width of the feature), such as a feature with an aspectratio equal or greater than 5:1, 10:1, 20:1, 25:1, 30:1, 35:1, 40:1,50:1, or 100:1. Various embodiments of the dummy gate layer formationprocess include a cyclic process for depositing a film in high aspectratio trenches defined between neighboring fins and treating the topportions of the film proximate tops and top sidewalls of the fins with ahalogen-containing treatment gas so that the film growth at the topportions of the film proximate tops and/or top sidewalls of the fins isreduced, inhibited, or minimized during the subsequent deposition stageof the cyclic process. Since the film growth at the top portion can bereduced, the film can be selectively grown from the trench bottom andprevent the opening of the trenches from pinching off prematurely andtrap a seam or void within the trenches. Therefore, a bottom up fillingcan be achieved in a seam-free or void-free fashion.

At operation 106, a dummy gate layer formation process is performed todeposit a dummy gate layer over the substrate surface (e.g., exposedsurfaces of the interfacial dielectric layer 202 (or the seed layer 204if used) and fill the trenches 253. FIG. 2 illustrates an example dummygate layer formation process 150 that can be used during the operation106 according to some embodiments, and FIGS. 5 to 14A are schematiccross-sectional views of a portion of the semiconductor device structure240 corresponding to various stages of trench filling according to theflow chart of FIG. 2. The dummy gate layer formation process 150generally includes a film deposition process 152, a top treatmentprocess 154, and a film deposition process 156. A purge gas such as aninert gas may be flowed into the processing chamber (in which thesemiconductor device structure 240 is disposed) between the filmdeposition process 152, the top treatment process 154, and the filmdeposition process. For example, the dummy gate layer formation process150 may include cycles of the film deposition process 152, followed by achamber purge, followed by the top treatment process 154, followed by achamber purge, followed by the film deposition process 156, and followedby a chamber purge. The inert gas may be any suitable inert gas such asargon, helium, neon, or any combinations thereof.

The film deposition processes 152, 156 and the top treatment process 154may be performed in the same or different processing chamber. Thedeposition-treatment processes can be repeated sequentially and/oralternatingly to gradually fill the trenches 253. After a pre-determinednumber of sequences or cycles of the deposition-treatment processes, thefilm formed can fill the trenches, such as the trenches 253 from bottomto top without forming seam or void. This cyclic deposition-treatmentprocesses can be repeated until the complete trench fill is achieved 158or a desired height of the dummy gate layer is achieved. Thereafter, theflow chart 100 may proceed to operation 108.

The film deposition process 152 includes forming a film 206 over thesubstrate surface, as shown in FIG. 5. In some embodiments, thesubstrate surface may include exposed surface of the interfacialdielectric layer 202 that is conformally formed on fins 274 and theupper surfaces of the isolation regions 248. In some embodiments, thesubstrate surface may include exposed surface of the seed layer 204 thatis conformally formed on the interfacial dielectric layer 202. Invarious embodiments, the film 206 formed by the film deposition process152 may include or be any material suitable for a dummy gate layer.Suitable material for the film 206 may include amorphous silicon (a-Si)or poly-silicon. In an example, the film 206 formed by the filmdeposition process 152 is amorphous silicon. Amorphous silicon has beenfound to be advantageous in filling high aspect ratio trenches for gatesbecause it can provide good etch selectivity with respect to other films(e.g., silicon oxide, amorphous carbon, etc.) in subsequent processes.The film deposition process 152 can be any suitable deposition processincluding, but is not limited to, low-pressure chemical vapor deposition(LPCVD), chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD),atomic layer deposition (ALD), plasma-enhanced ALD (PEMLD), or anysuitable deposition technique that can produce a solid phase material onthe substrate surface. In some embodiments, the film deposition process152 is performed using LPCVD. LPCVD may be advantageous in someapplications since it can deposit a wide range of film compositions withgood conformal step coverage.

The film 206 may be formed by exposing the substrate surface to asilicon-containing precursor. Suitable silicon-containing precursors mayinclude silanes, halogenated silanes, or any combinations thereof.Silanes may include silane (SiH₄) and higher silanes with the empiricalformula Si_(x)H_((2x+2)), such as disilane (Si₂H₆), trisilane (Si₃H₈),and tetrasilane (Si₄H₁₀). Halogenated silanes may include, but are notlimited to, a chlorinated silane, such as monochlorosilane (SiH₃Cl,MCS), dichlorosilane (Si₂H₂Cl₂, DCS), trichlorosilane (SiHCl₃, TCS),hexachlorodisilane (Si₂Cl₆, HCDS), octachlorotrisilane (Si₃Cl₈, OCTS),or silicon tetrachloride (STC). In some embodiments, thesilicon-containing precursor may use organosilanes which may includecompounds with the empirical formula R_(y)Si_(x)H_((2x+2−y)), where R isindependently methyl, ethyl, propyl, or butyl, such as methylsilane((CH₃)SiH₃), dimethylsilane ((CH₃)₂SiH₂), ethylsilane ((CH₃CH₂)SiH₃),methyldisilane ((CH₃)Si₂H₅), dimethyldisilane ((CH₃)₂Si₂H₄),hexamethyldisilane ((CH₃)₆Si₂), tris(dimethylamino)silane (TDMAS), andany combination thereof. In some cases, the silicon-containing precursormay be carbon-free.

Example film deposition process 152 may involve using a LPCVD reactor toprocess a batch of wafers, such as the semiconductor device structure240. The wafers are stacked side by side and placed in a boat or cageheld in the LPCVD reactor. The reactor is heated and maintained byheating elements of the LPCVD reactor at a temperature in a range fromabout 120° C. to about 550° C., such as about 200° C. to about 500° C.,for example about 250° C. to about 450° C. A silicon-containingprecursor, such as SiH₄, Si₂H₆, Si₂H₂Cl₂, SiHCl₃, Si₂Cl₆, or anycombination thereof, may be introduced into the LPCVD reactor from a gasinjector located at a sidewall of the LPCVD reactor. In some examples,the silicon-containing precursor includes SiH₄ and Si₂H₆. Thesilicon-containing precursor is flowed from the gas injector andlaterally across the substrate surface of the semiconductor devicestructure 240 in a laminar flow-like manner (e.g., parallel to thesubstrate surface) such that the substrate surface of the semiconductordevice structure 240 is exposed to, or in the presence of thesilicon-containing precursor. The pressure inside the reactor ismaintained at about 20 mTorr to about 4.5 Torr, such as about 0.15 Torrto about 1 Torr, for example about 0.25 Torr, using an exhaust pump andan adjustable exhaust valve. The film deposition process 152 forms thefilm, e.g., a-Si, over the substrate surface with a thickness of aboutno Angstroms to about 100 Angstroms.

After the film deposition process 152, the dummy gate layer formationprocess 150 continues to the top treatment process 154 to form apassivation layer 208 at a top portion of the fins 274. The passivationlayer 208 may be formed by treating the substrate surface with atreatment gas so that the passivation layer 208 is formed on the film206 (or in the surface layer of the film 206) located at a top portionof the fins 274, as shown in FIG. 6. In some embodiments, the substratesurface may include the exposed surface of the film 206 on theinterfacial dielectric layer 202 located at the top portion of the fins274. In some embodiments, the substrate surface may include the exposedsurface of the film 206 on the seed layer 204 located at the top portionof the fins 274. The top portion of the fins 274 may include a topsurface 259 of the fins 274 and an upper portion of sidewall surfaces ofthe fins 274.

The top treatment process 154 can allow the passivation layer 208 toform primarily at the top portion of the fins 274 because the reactionof the treatment gas at the top portion of the fins 274 is typicallyfaster than that at the sidewall surfaces 257, with the bottom surface255 of the trenches being the slowest due to a high aspect ratio of thetrenches. It has been observed that performing the top treatment process154 at higher temperatures (e.g., about 350° C. or above) can promotethe reaction of the treatment gas with the film 206 at the top portionof the fins 274 over the reactions at the sidewall surfaces 257 and thebottom surface 255 of the trenches. In addition, when the film 206 isexposed to the treatment gas for a short period of time, the reaction atthe sidewall surfaces 257 and the bottom surface 255 can be less thanthe top portion of the fins 274 due to limited exposure to the treatmentgas. Since the surface reaction rate is very sensitive to temperature inLPCVD, the temperature and process time of the top treatment process 154can be adjusted so that the treatment reaction occurs selectively at thetop portion of the fins 274.

During the top treatment process 154, the semiconductor substrate 270may be maintained at a temperature in a range from about 350° C. toabout 600° C., such as about 400° C. to about 550° C., for example about420° C. to about 500° C., during the top treatment process 154. In someexamples, the semiconductor substrate 270 is maintained at a temperaturein a range from about 350° C. to about 450° C. during the top treatmentprocess 154. The top treatment process 154 may be performed for aduration in a range of about 1 second to about 120 seconds, such asabout 5 seconds to about 60 seconds, for example about to seconds toabout 45 seconds.

The top treatment process 154 may be performed in the presence of thetreatment gas in a processing chamber that is maintained at elevatedtemperatures (e.g., 350° C. or above) sufficient to dissociate thetreatment gas. The treatment gas may be any gas suitable for passivatingthe film 206. In some embodiments, the treatment gas is ahalogen-containing precursor. The halogen species chemically react withand/or passivate the exposed surface of the film 206 at the top portionof the fins 274 to form the passivation layer 208 thereon. Thepassivation layer 208 may be a halogen surface layer (e.g., monolayer ofhalogen species) or a halogen-terminated layer of the film (e.g.,silicon). The halogen surface layer or halogen-terminated layer ofsilicon can inhibit, limit, or significantly slow down the film growthreaction over the top portion of the fins 274 during the subsequent filmdeposition process 156. In some embodiments, the treatment gas is ahalogen precursor such as fluorine (F₂) or chlorine (Cl₂).

In some embodiments, the treatment gas is a hydrogen halide where thehalogen is selected from the group consisting of fluorine, chlorine,bromine, iodine, or astatine. Suitable halogen hydride may includehydrogen bromide (HBr), hydrogen iodide (HI), hydrogen chloride (HCl),hydrogen fluoride (HF), hydrogen astatide (HAt), or any mixturesthereof. In some examples, the treatment gas is chlorine-free (e.g., HIor HBr). In some examples, the treatment gas is not a pure chlorine,halogen-containing precursor (e.g., HCl) to avoid excessive etching ofthe film 206 at the fin top. The top treatment process 154 can beperformed in the same processing chamber as the film deposition process152. For example, the top treatment process 154 and the film depositionprocess 152 can be both performed in a LPCVD reactor. If desired, thetop treatment process 154 and the film deposition process 152 can beperformed in different processing chambers. For example, the toptreatment process 154 can be performed in a PECVD chamber while the filmdeposition process 152 is performed in a LPCVD reactor.

While the halogen from the treatment gas may etch a small portion of thefilm 206 during the top treatment process 154, some halogen-containingprecursors are found to have a significant slower etch rate withamorphous silicon at high temperatures, such as 350° C. or above, forexample about 400° C. or above. For example, HI or HBr can etch the film206 over the top portion of the fins 274 at an etch rate that is totimes slower, or even 100 times slower as compared to the treatment gasusing Cl₂ or HF at 370° C. or below. In any cases, thehalogen-containing precursor does not etch through the film 206 toexpose the underlying layer (e.g., the interfacial dielectric layer 202or the seed layer 204 if used). That is, the thickness of the film 206etched or removed during the top treatment process 154 is generally lessthan the thickness of the film deposited during the film depositionprocess 152.

Example top treatment processes 154 includes using a LPCVD reactor toprocess a batch of wafers, such as the semiconductor device structure240. Likewise, the wafers are stacked side by side and placed in a boator cage held in the LPCVD reactor. The reactor is heated and maintainedby heating elements of the LPCVD reactor at a temperature of about 350°C. or above, such as about 400° C. or above, such as about 450° C. toabout 650° C., for example about 500° C. to about 550° C. The substratesurface of the semiconductor device structure 240 is exposed to, or isin the presence of a halogen-containing precursor, such as HBr, HI, HCl,Cl₂, or any combination thereof. In some examples, thehalogen-containing precursor is HBr. In another example, thehalogen-containing precursor is HI. The halogen-containing precursor maybe introduced into the LPCVD reactor from a gas injector located at asidewall of the LPCVD reactor. In some embodiments, thehalogen-containing precursor is flowed from the gas injector andlaterally across the substrate surface of the semiconductor devicestructure 240 in a laminar flow-like manner (e.g., parallel to thesubstrate surface) such that the substrate surface of the semiconductordevice structure 240 is exposed to, or in the presence of thehalogen-containing precursor. The pressure inside the reactor ismaintained in a range from at about 1 Torr to about 80 Torr, such asabout 4.5 Torr to about 20 Torr, for example about 10 Torr, using anexhaust pump and an adjustable exhaust valve. After the top treatmentprocess 154, the film 206 at the top portions of the fins 274 is coveredwith a passivation layer having a thickness of about 2 nm or less, suchabout 1.5 nm or less, for example about 0.1 nm to about 1 nm.

The passivation layer 208 on the film 206 at the top portion of the finshas a sidewall surface that has a first dimension D1 that issubstantially vertical (e.g., parallel to a sidewall surface of the fin274), and the film 206 has a sidewall surface that has a seconddimension D2 that is substantially vertical. The ratio of D1:D2 may varydepending upon the application and process parameters such as treatmenttemperature, time, and/or pressure, etc. For example, the ratio of D1:D2may be about 1:2 or less, such as about 1:3, about 1:4, about 1:5, about1:6, about 1:7, about 1:8, about 1:9, about 1:10, about 1:11, about1:12, etc. In some examples, the ratio of D1:D2 is about 1:3 to about1:10, such as about 1:4 to about 1:6, for example about 1:5. It iscontemplated that the ratio of D1:D2 can be adjusted according to thesizes of respective components of the semiconductor device structure.

After the top treatment process 154, the dummy gate layer formationprocess 150 proceeds to the film deposition process 156. The filmdeposition process 156 can be identical to the film deposition process152 as discussed above. The film deposition process 156 forms the newfilm (e.g., a-Si) on the passivation layer 208. The passivation layer208 is thus buried under the new film once the film deposition process156 is finished, as shown in FIG. 7. Since the passivation layer 208limits or significantly slows down the film growth reaction on the film206 at the top portions of the fins 274, the new film formed during thefilm deposition process 156 generally grows on the untreated or lesstreated surface of the film 206 at the bottom surface 255 and sidewallsurfaces 257 of the trenches 253 at a greater rate than on thepassivation layer 208 on the film 206 at the top portions of the fins274. While the new film 206 may still form on and cover the passivationlayer 208 at the top portions of the fins 274, the deposition reactionof the new film 206 generally occurs at a significant slower rate at thetop portions of the fins 274 due to the presence of the passivationlayer 208. The passivation layer 208 causes the new film 206 to beselectively or prominently grown on the film 206 over the bottom surface255 and sidewall surfaces 257 of the trenches 253 not being covered bythe passivation layer 208. Therefore, the film profile at the bottomsurface 255 and the sidewall surfaces 257 of the trenches 253 is formedthicker than the film profile at the top portion of the fins 274, asshown in FIG. 7. For clarity, the passivation layer 208 from the toptreatment process 154 is not shown in FIG. 7, although the passivationlayer 208 may remain or may react with a precursor and be purged as abyproduct. Having a thinner film profile at the top portion of the fins274 can be beneficial as it avoids the opening of the trenches 253 frommerging and trap a seam or void within the trenches.

In some embodiments where the dummy gate layer formation process 15 o isstill going on (and the trench fill has not yet completed), the filmdeposition process 156 may switch back to the top treatment process 154as soon as the new film 206 is about to form over the top portion of thefins 274, or a very limited growth of the new film 206 has been occurredover the top portion of the fins 274. A thickness-controlled ortime-controlled manner may be used to help decide whether to switch fromthe film deposition process 156 to the top treatment process 154. Inthis manner, the growth of the new film 206 over the top portions of thefins 274 can be kept to a minimum. For example, the new film 206 formedover the bottom surface 255 of the trenches 253 not being covered by thepassivation layer 208 may have a first thickness T1 and the new film 206formed on the passivation layer 208 (over the top portion of the fins274) may have a second thickness T2. The ratio of T1 to T2 during a filmdeposition process (e.g., film deposition process 156) may be about 10:1or greater, such as about 30:1 or greater, for example about 60:1 orgreater. In some cases, the ratio of T1 to T2 may be about 60:1 to about80:1, or even about 100:1 or greater. The ratio of T1 to T2 can be usedto determine whether the film deposition process 156 should be switchedto the top treatment process 154 to minimize the growth of the new film206 over the top portion of the fins 274. In various embodiments, thefilm deposition process 156 may switch to the top treatment process 154as soon as the ratio of T1 to T2 reaches 30:1 or above, such as about50:1 or above, for example about 100:1 or above. This switch maycontinue until the trench fill is completed.

After the film deposition process 156, the dummy gate layer formationprocess 150 proceeds to a decision box 158 to determine whether the gateformation is completed. If not, the dummy gate layer formation process150 proceeds to perform the top treatment process 154 and the filmdeposition process 156 as discussed above until the dummy gate formationlayer process 150 is completed. The dummy gate layer formation process150 may be completed when the film fills the trenches 253 between fins274 and reaches a pre-determined height over the top of fins 274. Forexample, the pre-determined height may be in a range from about 100 Å toabout 1000 kA, such as about 150 Å to about 300 Å. It is contemplatedthat the pre-determined height may vary depending upon the height neededfor the gate structures, e.g., gate structures 251 shown in FIGS. 15Aand 15C.

FIGS. 8 to 13 illustrate various stages of the semiconductor devicestructure 240 going through multiple cycles of the deposition-treatmentprocess (e.g., processes 154, 156) according to some embodiments. Forclarity, the passivation layer(s) formed from the previous top treatmentprocesses 154 (e.g., as the passivation layer 208 shown in FIG. 7) isnot shown. As can be seen, the film top treatment process 154 againpassivates the exposed surface of the film 206 at the top portion of thefins 274 formed during the previous film deposition process to form apassivation layer 208 thereon, as shown in FIG. 8. Thereafter, the filmdeposition process 156 is performed to form the new film 206preferentially or selectively on the untreated or less treated surfaceof the film 206 over the bottom surface 255 and sidewall surfaces 257 ofthe trenches 253, as shown in FIG. 9. Due to the presence of thepassivation layer 208, the deposition reaction would occur at a slowerrate at the top portions of the fins 274, resulting in a thicker filmprofile at the bottom surface 255 and the sidewall surfaces 257 of thetrenches 253 than the film profile at the top portion of the fins 274,as shown in FIG. 9.

FIGS. 10 and 11 illustrate the semiconductor device structure 240 goingthrough another cycle of deposition-treatment process (e.g., processes154, 156). As can be seen, the film top treatment process 154 againpassivates the exposed surface of the film 206 at the top portion of thefins 274 formed during the previous film deposition process to form apassivation layer 208 thereon, as shown in FIG. 1. Thereafter, the filmdeposition process 156 is performed to preferentially or selectivelyform the new film 206 on the untreated or less treated surface of thefilm 206 over the bottom surface 255 and sidewall surfaces 257 of thetrenches 253. Likewise, due to the presence of the passivation layer208, the deposition reaction would result in a thicker film profile atthe bottom surface 255 and the sidewall surfaces 257 of the trenches 253than the film profile at the top portion of the fins 2741, as shown inFIG. 11. After this cycle of the deposition-treatment process, the edgeof the new film 206 is moved away from the bottom surface 255 and thesidewall surfaces 257 of the trenches 253 as compared to the state inthe previous cycle (FIG. 9). At the same time, the thickness of the film206 at the top portion of the fins 274 remains thin and thus it canavoid the opening of the trenches 253 from pinching off and trap a seamor void within the trenches.

FIGS. 12 and 13 illustrate the semiconductor device structure 240 goingthrough yet another cycle of deposition-treatment process (e.g.,processes 154, 156). As can be seen, the film top treatment process 154again passivates the exposed surface of the film 206 at the top portionof the fins 274 formed during the previous film deposition process toform a passivation layer 20 o 8 thereon, as shown in FIG. 12.Thereafter, the film deposition process 156 is performed topreferentially or selectively form the new film 206 on the untreated orless treated surface of the film 206 over the bottom surface 255 andsidewall surfaces 257 of the trenches 253, resulting in a thicker filmprofile at the bottom surface 255 and the sidewall surfaces 257 of thetrenches 253 than the film profile at the top portion of the fins 274.After this cycle of the deposition-treatment process, the film 206 grownalong the sidewall surfaces 257 of the trenches 253 between neighboringfins 274 may have been merged or contacted to each other, as shown inFIG. 13. The film 206 over the top portion of neighboring fins 274,however, remains un-merged due to the presence of the passivation layer208. The edge of the new film 206 is moved further away from the bottomsurface 255 of the trenches 253 as compared to the previous cycle (FIG.11). In addition, the thickness of the film 206 at the top portion ofthe fins 274 still remains thin and thus it can avoid the opening of thetrenches 253 from pinching off prematurely and trap a seam or voidwithin the trenches.

FIG. 14A illustrates the trenches 253 between neighboring fins 274 havebeen completely filled with substantially no seam or void (e.g., a seamand/or void takes up less than about 1% of the volume of the trenches253) after a suitable number of sequences or cycles of thedeposition-treatment processes. The deposition process (e.g., the filmdeposition process 152, 156) may be performed to continue the depositionof the film 206 over the substrate surface until a pre-determined heightis reached. FIG. 14B illustrates a three-dimensional view of thesemiconductor device structure 240 of FIG. 14A where the dummy gatelayer (i.e., the film 206) has been formed over the substrate surfaceaccording to some embodiments. After the dummy gate layer is formed andthe trenches are filled, the flow chart 100 may proceed to operation108, as will be discussed below in more detail. In some examples, thefilm 206 may be planarized, such as by a chemical mechanicalplanarization (CMP), to form a top surface of the film 206 to be planar.

While the dummy gate layer material using silicon is discussed, theconcept described herein is equally applicable to other materials suchas silicon germanium (Si_(x)Ge_(1-x), where x can be betweenapproximately 0 and 1), silicon carbide, silicon phosphorus, siliconcarbon phosphorus, germanium, a III-V compound semiconductor, a II-VIcompound semiconductor, or the like. In cases where silicon germanium isdesired, a germanium-containing precursor (e.g., GeH₄, Ge₂H₆, etc.) or ahalogenated germanium precursor (e.g., GeCl₄, GeHCl₃, Ge₂Cl₆, Ge₃Cl₆,etc.) may be used in conjunction with any of the silicon-containingprecursors in a similar fashion as discussed above in FIG. 2 to fill thetrenches, such as the trenches 253.

At operation 108, and with reference to FIGS. 15A, 15B, and 15C, a mask254 is formed over the dummy gate layer (i.e., film 206) and the mask254, dummy gate layer, and interfacial dielectric layer 202 (and seedlayer 204 if used) may then be patterned, for example, usingphotolithography and one or more etch processes to form the mask 254,dummy gate layer (i.e., the film 206), and interfacial dielectric layer202 for each gate structure, e.g., gate structure 251, as shown in FIGS.15A and 15C. The mask 254 may include or be silicon nitride, siliconoxynitride, silicon carbon nitride, the like, or a combination thereof,deposited by CVD, PVD, ALD, or any suitable deposition technique.Particularly, the gate structures 251 are over and extendperpendicularly to the fins 274.

FIG. 15C further illustrates reference cross-sections. Cross-section A-Ais in a plane along, e.g., channels in the fin 274 between opposingsource/drain regions 292. Cross-section B-B is in a plane perpendicularto cross-section A-A and is across source/drain regions 292 in twoneighboring fins 274. Cross-section B-B of FIG. 15C corresponds to aportion of the cross-section A-A of FIG. 3; a person having ordinaryskill in the art will readily understand how processing of thecross-section B-B of FIG. 15C can be extrapolated to the cross-sectionA-A of FIG. 3. FIG. 15A and following figures ending with an “A”designation illustrate cross-sectional views at various instances ofprocessing corresponding to cross-section A-A of FIG. 15C, and FIG. 15Band following figures ending with a “B” designation illustratecross-section views at various instances of processing corresponding tocross-section B-B of FIG. 15C.

At operation 110, and with reference to FIGS. 16A and 16B, gate spacers286 are formed along sidewalls of the gate structures 251 (e.g.,sidewalls of the gate interfacial dielectric layer 202, dummy gate layer(i.e., the film 206), and mask 254) and over the fins 274. The gatespacers 286 may be formed by conformally depositing one or more layersfor the gate spacers 286 and anisotropically etching the one or morelayers, for example. The one or more layers for the gate spacers 286 mayinclude a material different from the material(s) for the gate structure251. In some embodiments, the gate spacer 286 may include or be adielectric material, such as silicon oxygen carbide, silicon nitride,silicon oxynitride, silicon carbon nitride, the like, multi-layersthereof, or a combination thereof, and may be deposited by any suitabledeposition technique. An anisotropic etching process is then performedto remove portions of the spacer layers to form the gate spacers 286, asdepicted in FIGS. 16A and 16B.

After the gate spacers 286 are formed, source/drain regions 292 may beformed in the fins 274, as depicted in FIGS. 16A and 16B. In someexamples, recesses can be etched in the fins 274 using the gatestructures 251 and gate spacers 286 as masks (such that recesses areformed on opposing sides of the gate structures 251), and a material maybe epitaxially grown in the recesses to form the source/drain regions292. Additionally or alternatively, the source/drain regions 292 may beformed by implanting dopants into the fins 274 and/or the epitaxialsource/drain regions 292 using the gate structures 251 as masks (suchthat the source/drain regions are formed on opposing sides of the gatestructures 251).

Depending on the conductivity type of the transistor, the material forthe source/drain regions 292 may be chosen to include or be silicongermanium, silicon carbide, silicon phosphorus, silicon carbonphosphorus, pure or substantially pure germanium, a III-V compoundsemiconductor, a II-VI compound semiconductor, or the like. Thesource/drain regions 292 may be raised with respect to the fins 274 andmay have facets, which may correspond to crystalline planes of thesemiconductor substrate 270.

An optional contact etch stop layer (CESL) 296 and a first interlayerdielectric (ILD) 297 are sequentially formed on surfaces of thesource/drain regions 292, sidewalls and top surfaces of the gate spacers286, top surfaces of the masks 254, and top surfaces of the isolationregions 248 using any suitable deposition technique. The CESL 296 isdeposited conformally and may include or be silicon nitride, siliconcarbon nitride, silicon carbon oxide, carbon nitride, the like, or acombination thereof. The first ILD 297 may include or betetraethylorthosilicate (TEOS) oxide, silicon dioxide, a low-kdielectric material (e.g., a material having a dielectric constant lowerthan silicon dioxide). A CMP process may then be performed to planarizethe first ILD 297 and the CESL 296 and to remove the masks 284 of thegate structures 251, thereby leveling the top surface of the first ILD297 and CESL 296 with the top surfaces of the dummy gate layers (i.e.,the film 206).

At operation 112, and with reference to FIGS. 16A and 16B, the dummygate structures 251 are removed and replacement gate structures 228 a,228 b are formed where the dummy gate structures 251 were removed. Thegate structures 251 can be removed using one or more etch processes.Upon removal of the gate structures 251, recesses are formed between thegate spacers 286 where the gate stacks are removed, and channel regionsof the fins 274 are exposed through the recesses. The replacement gatestructures 228 a, 228 b are then formed in the recesses where the gatestructures 251 were removed. The replacement gate structures 228 a, 228b each may include, as illustrated in FIG. 17A, an interfacialdielectric 220, a gate dielectric layer 222, one or more optionalconformal layers 224, and a gate conductive fill material 226. Theinterfacial dielectric 220 is formed on top surfaces of the fins 274along the channel regions. The interfacial dielectric 220 can be anoxide (e.g., silicon oxide) formed by thermal or chemical oxidation ofthe fin 274, and/or an oxide (e.g., silicon oxide), nitride (e.g.,silicon nitride), and/or another dielectric layer using any suitabledeposition technique.

The gate dielectric layer 222 can be conformally deposited in therecesses where gate stacks were removed (e.g., on the interfacialdielectric 220, and sidewalls of the gate spacers 286) and on the topsurfaces of the first ILD 297, the CESL 296, and gate spacers 286. Thegate dielectric layer 222 can be or include silicon oxide, siliconnitride, a high-k dielectric material, multilayers thereof, or otherdielectric material. A high-k dielectric material may have a k valuegreater than about 4.0, and may include a metal oxide of or a metalsilicate of hafnium (Hf), aluminum (Al), zirconium (Zr), lanthanum (La),magnesium (Mg), barium (Ba), titanium (Ti), lead (Pb), multilayersthereof, or a combination thereof.

The one or more optional conformal layers 224 can include one or morebarrier and/or capping layers and one or more work-function tuninglayers. The one or more barrier and/or capping layers can includetantalum nitride, titanium nitride, the like, or a combination thereof.The one or more work-function tuning layer may include or be aluminumtitanium carbide, aluminum titanium oxide, aluminum titanium nitride,the like, or a combination thereof. The materials for the one or morework-function tuning layer, the barrier layer and/or capping layer areselected so that a desired threshold voltage (Vt) is achieved for thetransistor, which could be a p-type field effect transistor (pFET) or ann-type field effect transistor (nFET). A layer for the gate conductivefill material 226 is formed over the one or more conformal layers 224,if implemented, and/or the gate dielectric layer 222. The layer for thegate conductive fill material 226 can fill remaining recesses where thegate stacks were removed. The layer for the gate conductive fillmaterial 226 may be or include a metal-containing material such astungsten, cobalt, aluminum, ruthenium, copper, multi-layers thereof, acombination thereof, or the like.

A planarization process, like a CMP, may remove portions of the layerfor the gate conductive fill material 226, one or more conformal layers224, and gate dielectric layer 222 above the top surfaces of the firstILD 297, the CESL 296, and gate spacers 286. The replacement gatestructures 228 including the gate conductive fill material 226, one ormore conformal layers 224, gate dielectric layer 222, and interfacialdielectric 220 may therefore be formed as illustrated in FIG. 17A.

A second ILD 230 is formed over the gate conductive fill material 226,one or more conformal layers 224, and gate dielectric layer 222, firstILD 297, gate spacers 286, and CESL 296, as shown in FIGS. 18A and 18B.The second ILD 230 may include or be silicon dioxide, a low-k dielectricmaterial, such as silicon oxynitride, PSG, BSG, BPSG, USG, FSG, OSG,SiO_(x)C_(y), Spin-On-Glass, Spin-On-Polymers, silicon carbon material,a compound thereof, a composite thereof, the like, or a combinationthereof.

After the second ILD 230 is formed, source/drain contact openings areformed through the second ILD 230, the first ILD 297, and the CESL 296to the source/drain regions 292 to expose at least portions of thesource/drain regions 292. The second ILD 230, the first ILD 297, and theCESL 296 may be patterned with the openings, for example, usingphotolithography and one or more etch processes, such as a dry etch orany suitable anisotropic etch process. The source/drain contact openingsallow making electrical contact to the source/drain regions 292 for thetransistors.

After the formation of the source/drain contact openings, conductivefeatures are formed in the openings to the source/drain regions 292. Theconductive features may include a silicide region 214 formed on thesource/drain regions 292, a barrier layer 219, and a conductive material221 on the barrier layer 219. The silicide region 214 may be formed bythermally reacting an upper portion of the source/drain regions 292 witha metal layer (not shown), such as titanium, tantalum, or the like,formed on the source/drain regions 292. The barrier layer 219 isconformally deposited in the source/drain contact openings on thesilicide layer 214 and over the second ILD 230, the first ILD 297, andthe CESL 296, as shown in FIGS. 18A and 18B. The barrier layer 219 maybe or include titanium nitride, titanium oxide, tantalum nitride,tantalum oxide, any suitable transition metal nitrides or oxides, thelike, or any combination thereof, and may be deposited by ALD, CVD,PECVD, HDP-CVD, low-pressure CVD (LPCVD), or physical vapor deposition(PVD), or any suitable deposition technique. The conductive material 221may be or include cobalt, tungsten, copper, ruthenium, aluminum, gold,silver, alloys thereof, the like, or a combination thereof, and may bedeposited by CVD, ALD, PVD, ECP or any suitable deposition technique.After the conductive material 221 is deposited, excess conductivematerial 221 and barrier layer 219 may be removed by using aplanarization process, such as a CMP. The planarization process mayremove excess conductive material 221 and barrier layer 219 from above atop surface of the first ILD 297. Hence, top surfaces of the conductivematerial 221, the barrier layer 219, and the first ILD 297 may becoplanar. The conductive features may be referred to as contacts, plugs,etc.

Various embodiments described herein may offer several advantages. Itwill be understood that not all advantages have been necessarilydescribed herein, no particular advantage is required for anyembodiment, and other embodiments may offer different advantages. As anexample, embodiments described herein include improved gate formationmethods for forming a gate layer (e.g., a-Si) in high aspect ratiotrenches using a cyclic deposition-treatment process in a LPCVD)reactor. The cyclic deposition-treatment process deposits a film layerin the trenches defined between neighboring fins and treating the filmlayer at the tops and/or top sidewall of the fins with ahalogen-containing treatment gas at a temperature of 350° C. or above sothat the film growth at the top and/or top sidewall of the fins isreduced, inhibited, or minimized during the subsequent deposition stageof the cyclic process. Since the film growth at the top and/or topsidewall of the fins is reduced, the subsequent film can be selectivelygrown from the trench bottom and thus can prevent the opening of thetrenches from pinching off prematurely and trap a seam or void withinthe trenches. Therefore, a bottom up filling can be achieved in aseam-free or void-free fashion.

In an embodiment, a method for semiconductor process is provided. Themethod includes subjecting a substrate surface having at least onefeature to a film deposition process to form a conformal film over abottom surface and along sidewall surfaces of the feature, subjectingthe substrate surface to a treatment process to form respective halogensurface layers or respective halogen-terminated layers on the conformalfilm formed at respective upper portions of the sidewall surfaces, andperforming sequentially and repeatedly the film deposition process andthe treatment process to fill the feature with the film.

In another embodiment, the method includes forming fins on a substrate,sidewalls of the fins and a bottom surface defining a trenchtherebetween, filling the trench with a gate layer comprising performinga cyclic deposition-treatment process on the substrate in a processingchamber, and after the trenches are filled with the gate layer,patterning the gate layer to form a gate structure over the fins. Thecyclic deposition-treatment process includes forming a first portion ofthe gate layer in the trench and along the sidewalls of the fins,forming respective passivation layers on the first portion of the gatelayer formed at respective top portions of the fins, and forming asecond portion of the gate layer on the first portion of the gate layernot covered by the passivation layer.

In one another embodiment, a method is provided. The method includesforming fins on a substrate, sidewalls of the fins and a bottom surfacedefining a trench therebetween, forming a dummy gate layer over thefins, and after forming the dummy gate layer, patterning the dummy gatelayer to form a gate structure over the fins, wherein forming the dummygate layer over the fins includes introducing a deposition gas, in afirst deposition process, into a processing chamber in which thesubstrate is disposed to form a first portion of the dummy gate layer inthe trench and over the fins, after introducing the deposition gas inthe first deposition process, introducing a treatment gas into theprocessing chamber at a temperature of 350° C. or above to formrespective passivation layers on the first portion of the dummy gatelayer at respective top portions of the fins, after introducing thetreatment gas, introducing the deposition gas, in a second depositionprocess, into the processing chamber to form a second portion of thedummy gate layer on the first portion of the dummy gate layer notcovered by the respective passivation layers, the dummy gate layerformed at the respective top portions of the fins having a firstthickness T1, and the dummy gate layer at a bottom of the trench havinga second thickness T2, and after introducing the deposition gas in thesecond deposition process, switching the deposition gas to the treatmentgas when the ratio of T1 to T2 reaches 30:1 or above.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for semiconductor process, the methodcomprising: subjecting a substrate surface having at least one featureto a film deposition process to form a conformal film over a bottomsurface and along sidewall surfaces of the feature; subjecting thesubstrate surface to a treatment process to form respective halogensurface layers or respective halogen-terminated layers on the conformalfilm formed at respective upper portions of the sidewall surfaces; andperforming sequentially and repeatedly the film deposition process andthe treatment process to fill the feature with the film.
 2. The methodof claim 1, wherein the conformal film is amorphous silicon.
 3. Themethod of claim 1, wherein the film deposition process and the treatmentprocess are performed in a same processing chamber.
 4. The method ofclaim 3, wherein the same processing chamber is a low-pressure chemicalvapor deposition (LPCVD) chamber.
 5. The method of claim 1, wherein thetreatment process is performed by exposing the substrate surface to ahalogen-containing precursor at a temperature of 350° C. or above and achamber pressure in a range from 1 Torr to 80 Torr.
 6. The method ofclaim 5, wherein the halogen-containing precursor comprises hydrogenbromide (HBr), hydrogen iodide (HI), or hydrogen chloride (HCl).
 7. Themethod of claim 5, wherein the halogen-containing precursor is flowedlaterally across the substrate surface in a laminar flow-like manner. 8.The method of claim 1, wherein the respective upper portions of thesidewall surfaces have a first dimension on which the respective halogensurface layers or the respective halogen-terminated layers are formed,and the sidewall surfaces of the feature have a second dimension,wherein a ratio of the first dimension to the second dimension is in arange from 1:3 to 1:10.
 9. A method for semiconductor process, themethod comprising: depositing a first film on a substrate, the substratecomprising a first fin and a second fin, a first sidewall of the firstfin and a second sidewall of the second fin forming sidewalls of atrench, the first film extending over the first fin, the second fin, andthe trench; and treating the first film to form a halogen-containinglayer on the first film over the first fin and the second fin, the firstfilm along a bottom of the trench being substantially free of thehalogen-containing layer; and depositing a second film on the firstfilm, the first film and the second film comprising a same material,wherein a thickness of the second film is greater along the bottom ofthe trench than over the first fin and the second fin.
 10. The method ofclaim 9 further comprising treating the second film to form a secondhalogen-containing layer on the second film.
 11. The method of claim 9,wherein depositing the first film and treating the first film areperformed in a same process chamber.
 12. The method of claim 9, whereintreating the first film etches the first film.
 13. The method of claim9, wherein a vertical height of the first film to a vertical height ofthe halogen-containing layer is in a range of 1:4 to 1:6.
 14. The methodof claim 9, wherein the first film and the second film comprisesamorphous silicon.
 15. The method of claim 14, wherein treating thefirst film comprises exposing the first film to a treatment gas, whereinthe treatment gas comprises fluorine, chlorine, or a hydrogen halide.16. A method for semiconductor process, the method comprising:depositing a first film on a substrate, the substrate comprising a firstfin and a second fin, a first sidewall of the first fin and a secondsidewall of the second fin forming sidewalls of a trench, the first filmextending over the first fin, the second fin, and the trench; fillingthe trench with a gate layer, filling the trench comprising performing acyclic deposition-treatment process followed by a deposition process onthe substrate in a processing chamber: wherein each cycle of the cyclicdeposition-treatment process comprises: forming a first portion of thegate layer in the trench and along the sidewalls of the first fin andthe second fin; and treating the first portion to form ahalogen-containing layer on the first portion over the first fin and thesecond fin; and wherein performing the deposition process comprisesfilling the trench with a second portion, wherein the first portion andthe second portion comprises a same material.
 17. The method of claim16, wherein the first portion and the second portion comprises amorphoussilicon.
 18. The method of claim 16, wherein the processing chamber is alow-pressure chemical vapor deposition (LPCVD) chamber and a chamberpressure is in a range from 1 Torr to 80 Torr.
 19. The method of claim18, wherein the substrate during treating is at a temperature of 350° C.or above.
 20. The method of claim 16, wherein treating the first filmcomprises exposing the first film to a treatment gas, wherein thetreatment gas comprises fluorine, or a hydrogen halide.